AOI or Automated Optical Inspection is a technology used to detect defects in the production of circuit boards and semiconductors.
Our AOI equipment can identify defects as small as 5nm in semiconductor wafer bonding.
This helps our customers—high-end electronics manufacturers—eliminate defects early, ensuring top-quality products for industries like automotive, aerospace, and medical, which demand high precision.
High-end electronics manufacturers can eliminate defects early in the production process, ensuring high-quality products for industries with stringent precision standards, such as automotive, aerospace, military, and medical sectors.
The necessity of AOI inspection equipment
In fact, AOI emerged as an alternative to manual inspection, which was the primary method before.
However, with increasing industrialization, market demand, and the complexity of semiconductor and electronic product processes, manual inspection has become inefficient.
It cannot meet required standards, especially in large-scale production where defect identification rates drop significantly.
For companies like Apple, which require rigorous inspection at nearly every stage, manual inspection is insufficient to meet even basic standards.
The most important core of the AOI equipment is actually the image system and algorithm system two parts.
The high-resolution megapixel camera, combined with an ultra-high frame rate and multi-angle coaxial ring light source, captures clear images even in high-speed production environments.
Combined with a powerful algorithm system, such as the U.S.-patented system used in our AOI equipment, it can continuously identify defects like tiny beads and soldering issues in SMT processes, which are difficult for the human eye to detect.
Additionally, it allows for tracing back to the source of the problem through recorded data.
Types of products tested | Multi-Chip Modules, Hybrid ICs, Flip Chips, Ball Grid Array Packages, Micro Ball Grid Array Packages, MEMS, Waffle Disks, etc. |
Detectable defect | |
Gold (aluminum) wire defects | Missing, damaged, soldered, de-padded, warped/lifted |
Die defects | Missing,wrong parts, polarity, peeling, cracking, contamination |
Component defects | Location, Missing, Wrong Piece, Polarity, Tilt, Tombstone |
Epoxy defects | Contamination, under-volume, over-volume, bridging |
Solder defects | Contamination, under-volume, over-volume, bridging |
AOI has a wide range of applications but is primarily used in the SMT (electronics manufacturing) industry.
This includes specific inspection steps in semiconductor manufacturing, such as checking the uniformity and accuracy of solder paste on PCB boards after printing, and verifying component placement before reflow soldering to detect issues like misplacement, missing components, or damaged parts.
It also detects defects after reflow soldering, such as incorrect positioning, leakage, or broken components.
Our AOI equipment can achieve a 5nm detection level, making it easily applicable to quality inspection in semiconductor bonding processes.
Considering that revenue in SMT processing lines can be calculated by the second, Identifying issues early in the process allows for timely intervention, potentially saving millions of dollars in losses.
Moreover, a comprehensive testing system serves as a strong guarantee of yield rates, helping SMT factories meet high customer standards and secure orders.
Detection method | Detection Target | Testing process | Working Principle | difference and similarity |
Automated Optical Inspection | Inspection of product surface appearance defects
| Before and after SMD, before and after soldering
| Optical Imaging Comparison
| Interchangeable with SPI and complementary to Xray detection. |
In-Circuit Test | Electrical function testing
| Finished product testing
| Probe Electrical Inspection
| Mainly functional tests, no common ground |
Solder Paste Inspection | Solder Paste Printing Effect Inspection
| After solder paste printing only
| Optical scanning, 3D measurement
| Interchangeable with AOI, but only in the solder paste printing process |
Automated Visual Inspection | For surface inspection (not only for electronics)
| Both. Mainly cosmetic inspections.
| High Precision Image Processing
| Not exactly a specialized counterpart to the electronics industry |
X-ray inspection
| Internal Structure Inspection
| Post-soldering and finished product testing
| X-ray imaging
| Mainly different detection principles,AOI, SPI,AVI are considered optical methods, Xray inspection is mainly dependent on the principle of X-ray penetration |
AOI equipment has applications in various fields, however, this product is primarily designed for high-precision, high-demand industries and may not offer a price advantage in labor-intensive sectors.
Targeting mid-to-high-end electronics manufacturing, including semiconductors, display panels (with strict quality control), energy, automotive electronics, aerospace, and medical industries.
Detection Capability Component Parameters | |
Field of View (FOV) | 8.2 x 6.8 mm (0.32 x 0.27 in) (1x) |
Resolution | 3.4 micron (1x) |
Illumination | Proprietary Fusion Lighting™ Multi-Angle LEDs |
Imaging | 5-megapixel color camera (2448 x 2048) |
Optical Device | Proprietary high-resolution, low-distortion coaxial illumination with optional Focus Variation Measurement (FVM) metrology module |
AFVM - Metering Module | Focus Change Measurement Sensor |
Conveyor specifications | |
Maximum Substrate Size | 440 x 450 mm (17.3 x 17.7 inches) |
Minimum Substrate Size | 50 x 50 mm (2 x 2 inches) |
Substrate Edge Clearance | 3 mm (0.12 inches) |
Substrate thickness | 0.1 to 7.0 mm |
Maximum Substrate Weight | 3.0 kg (6.6 lbs) |
Clearance height | Top: 19 mm (0.75 in.) (50 mm travel); Bottom: 50 mm (2 in.) |
Conveyor height | 930 - 980 mm (36.6 - 38.6 inches) (configurable to 880 - 950 mm) |
Conveyor length | 1100 mm (43.3 inches) |
Conveyor direction | Left to right (configurable to right to left; please contact the JEENOCE technical team for details) |
High-resolution camera with millions of pixels accurately captures micron defects
Ultra-high frame rate camera supports real-time inspection in high-speed production lines to prevent missed defects
Multi-angle coaxial ring light source eliminates reflection interference to improve defect recognition rates
Our U.S.-patented algorithms automatically identify various defects using advanced vision technology
Continuously optimize the structural design and core algorithms of the equipment based on the feedback of global users
Aim for zero error rates through continuous iteration of AI, deep learning, machine vision, and other emerging technologies
Our team of world-class engineers offers global technical support
Identify potential risks in advance to avoid losses caused by defective products flowing into production
Support reverse traceability from finished products to raw materials to quickly locate the root cause of the problem
By accumulating production data and customizing algorithms, we continuously optimize inspection strategies
By providing solutions that assure clients of our ability to meet yield rate requirements
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