Solder Paste Inspection (SPI) technology，the best partner for the smart factory
The best partner for the smart factory
Successful process optimization to increase productivity depends on accurate and reliable measurement and inspection technology and analytical tools.
As electronics packaging and assembly processes become more complex, there is a need for higher performance, more accurate, and more reliable inspections.
In order to accurately measure the overall volume of micro-welding of 03015 chips, etc., it is necessary to perform a true three-dimensional inspection.
Based on the world's most advanced 3D measurement and inspection technology, Gaoying solves the shadow problem with True 3D inspection solutions, and is the best partner to optimize your company's production process.
Solutions for detecting plate bends
The test results are affected by the bent plate? JEENOCE's Z-tracking 3D bending compensation solution can extract PCB bending information at the same time as detection, and stably measure and compensate for the bending of any substrate.
Based on JEENOCE's unique 3D imaging processing & vision algorithm, it can achieve precise measurement even in various environments such as tilting, expansion, contraction, twisting, and bending.
In addition, the real-time automatic pad-referencing 2D compensation option automatically compensates for nonlinear inspection issues in real-time by analyzing the position of the PCB pad without the need for the ideal PCB Stencil design information defined in the CAD file through high-specification IR illumination.
Auto-Rework
This is a 3D SPI automatic solder filling solution based on the industry's best measurement accuracy and detection reliability, with both precision and convenience.
The auto-fill solution immediately resolves solder paste shortages that arise during the printing process, minimizing substrate scrap or rework costs, reducing operating costs and improving the efficiency of the entire line.
By adding an auto-fill option to JEENOCE's 3D SPI, true process optimization can be achieved beyond inspection equipment.
More than just solder paste inspection
Inspection is not limited to solder paste deposits.
The JEENOCE SPI system provides full board foreign body detection (WFMI), conductive adhesive, sintered silver paste detection, and all provide a complete color image display of results.
In-line automated inspection solution for large PCB applications
JEENOCE provides the perfect inspection solution for large long boards such as 1.300 mm LED light panels, which can be expanded up to 1.800 mm with long board options.
