Semiconductor Turnkey Solution System
Semicon Turnkey
Semiconductor-grade X-ray inspection systems help you produce high-quality, irreplaceable products
X-ray inspection requirements for semiconductor-grade wafers are more stringent than those for PCBA in standard SMT processing.
This is due to the complex structure and materials of semiconductor products and their critical role as core components in fully assembled devices.
Jeenoce offers X-ray inspection equipment from the world's leading manufacturer to help customers minimize early-stage project losses.

Semiconductor-grade X-ray inspection systems help you produce high-quality, irreplaceable products

Essential Ultrasonic Scanning Microscope for the High-End Semiconductor Industry
Ultrasonic scanning microscopes are widely used in semiconductors, materials science, medicine, pharmaceuticals, and industrial fields.
These microscopes utilize principles similar to the echolocation techniques used by bats and dolphins, enabling non-destructive detection of defects such as grain boundaries, cracks, delamination, voids, bubbles, and contaminants.
Ultrasonic scanning microscopes play a crucial role in the global high-precision inspection market, particularly for semiconductor integrated circuits.
To meet growing demand in the semiconductor industry, Jeenoce offers the world's most advanced ultrasonic scanning equipment, helping companies tackle production challenges throughout wafer manufacturing.

Essential Ultrasonic Scanning Microscope for the High-End Semiconductor Industry

Advanced packaging semiconductor void-free contact welding (joining) process
Contact welding(welding) is a kind of welding method for DCB to process substrate mainly (most) semiconductor products in vacuum environment through "teppan firing" process,Jeenoce is positioned as the middle and high-end SMT equipment solution integrator to introduce this equipment mainly to help semiconductor manufacturing customers to accelerate the production pace while producing high yield semiconductor products with the lowest void rate.
It should be noted that the difference between contact welding and pressure welding, formic acid reflow welding,the contact welding equipment adopted by Jeenoce is a special surface heating welding process (or thermal radiation and heat conduction) for the semiconductor industry, rather than pressure welding by mechanical pressing.
Although formic acid can be used to reduce the void rate and remove the surface oxidation problem caused by the welding process,but their processing technology is slightly different because of the different product types.

Advanced packaging semiconductor void-free contact welding (joining) process

Precision 3D AOI Equipment for High-Speed Bonding Process Inspection
Discover Jeenoce BondInspect AOI equipment for bonding processes with precise 3D defect detection and high-speed inline integration.

Precision 3D AOI Equipment for High-Speed Bonding Process Inspection

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