SMT Turnkey Solution System
SMT Turnkey
High-precision solder paste printing system with dual guarantees of high quality and high efficiency
Jeenoce solder paste printing systems solve key SMT challenges like paste deviation & stencil misalignment. Achieve micron-level precision with closed-loop feedback for 01005 components & complex PCBs. Boost yield & efficiency in automotive, medical & consumer electronics.

High-precision solder paste printing system with dual guarantees of high quality and high efficiency

Precision placement system for micro resistor to large IC
Discover Jeenoce's precision placement systems for components from 01005 to large ICs. Achieve micron-level accuracy, 92,000 CPH speed, and seamless SMT line integration for automotive, medical, and consumer electronics. Boost your yield and efficiency.

Precision placement system for micro resistor to large IC

SPI Solder Paste Inspection System that Reduces the Defect Rates by 80% in the SMT Assembly Industry
With the growing demand for electronics, products are increasingly miniaturized. This trend presents challenges in managing the contact area and spacing between miniature components and substrates (such as 0201 chips, and high-density, fine-pitch BGA and CSP array components).
To address this, Jeenoce introduced SPI equipment from a leading Korean manufacturer with 16 years of expertise in solder paste inspection.
Through comprehensive solder paste printing quality management—encompassing hardware configuration and software algorithm upgrades—this system helps customers minimize losses in the initial stage of the SMT assembly process—solder paste printing.

SPI Solder Paste Inspection System that Reduces the Defect Rates by 80% in the SMT Assembly Industry

Jeenoce Rehm Reflow Soldering Oven 8-Zone Lead-Free SMT Heating
Discover the Jeenoce Reflow Soldering Oven with 8 convection zones lead-free profiles and seamless automation for precise SMT PCB assembly.

Jeenoce Rehm Reflow Soldering Oven 8-Zone Lead-Free SMT Heating

Vacuum reflow soldering system with the lowest void ratio in the world
The vacuum reflow soldering process is increasingly recognized as a critical method for enhancing product reliability.
Through unique vacuum environment control, the void rate of solder joints can be controlled below 0.1%, which is especially suitable for the occasions with strict requirements of semiconductor LED packaging, IGBT power modules and so on.
The purpose of Jeenoce introducing the vacuum reflow soldering system which ranks world’s top three into SMT complete line solution is to provide high-quality welding solution to achieve zero-defect soldering quality for clients.

Vacuum reflow soldering system with the lowest void ratio in the world

Jeenoce CondensoXS Vapor Phase Soldering System with Precise Reflow Control
Discover Jeenoce CondensoXS vapor phase soldering system for precise vapor phase reflow with uniform heating and eco-friendly lead-free PCB soldering.

Jeenoce CondensoXS Vapor Phase Soldering System with Precise Reflow Control

Advanced X-Ray Inspection for PCB Defects with 3D Imaging and AI
Discover Jeenoce X-Inspect Pro advanced X-ray inspection for PCB defects with 3D imaging, 7000x magnification, and seamless SMT line integration.

Advanced X-Ray Inspection for PCB Defects with 3D Imaging and AI

A coating system that greatly extends the lifecycle of PCBs
The coating system is the final step in the SMT assembly process. It typically works in conjunction with the dispensing process to extend product life by applying a protective layer on the surface,Jeenoce has introduced a coating system imported from the United States into its SMT full-line solution, primarily targeting high-end industries such as military electronics, new energy automotive electronics, medical electronics, aerospace electronics, and others,which require high precision and need to adapt to the strict environment of high standards.

A coating system that greatly extends the lifecycle of PCBs

The world's most accurate automatic dispensing system for process control
The automatic dispensing system is a set of integrated automatic equipment designed for accurately controlling the dispensing, coating, and potting of fluids (such as glue used in various SMT patch processing) on the surface or within the structure of electronic products.Jeenoce introduced this system, leveraging 60 years of experience from the original U.S. factory, with the goal of improving production efficiency, reducing manual errors, lowering glue consumption, and ensuring product quality for our customers in industries such as automotive, aerospace, medical, pharmaceutical, and high-end electronics manufacturing.

The world's most accurate automatic dispensing system for process control

Jeenoce Integrated Milling and Sawing PCB Depaneling Machine
Discover the Jeenoce PCB Depaneling Machine with precision milling and sawing for stress-free PCB separation in high-volume SMT production.

Jeenoce Integrated Milling and Sawing PCB Depaneling Machine

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