Ultrasonic scanning microscopes are widely used in semiconductors, materials science, medicine, pharmaceuticals, and industrial fields.
These microscopes utilize principles similar to the echolocation techniques used by bats and dolphins, enabling non-destructive detection of defects such as grain boundaries, cracks, delamination, voids, bubbles, and contaminants.
Ultrasonic scanning microscopes play a crucial role in the global high-precision inspection market, particularly for semiconductor integrated circuits.
To meet growing demand in the semiconductor industry, Jeenoce offers the world's most advanced ultrasonic scanning equipment, helping companies tackle production challenges throughout wafer manufacturing.
To obtain clear ultrasonic scanning images, the transducer must be energized.
It is composed of piezoelectric materials (e.g., lithium niobate, piezoelectric ceramics, zinc oxide), lenses, and matching layers.
This activates the piezoelectric material, causing it to vibrate and emit ultrasonic waves.
The lens then focuses these waves into a concentrated beam directed at the product.
When ultrasonic waves encounter different materials inside the product, their behavior—such as reflection, scattering, absorption, or transmission—varies due to differences in material density.
The transducer receives these waves and converts frequency signals into electrical signals. These signals are then processed by image processing algorithms and presented to inspectors as images with varying brightness, enabling defect detection.
Why Use Water as a Detection Medium?
Because ultrasonic waves attenuate rapidly in air, a stable medium like water is used between the transducer and the product to ensure efficient and interference-free transmission.
Low-frequency ultrasonic waves have longer wavelengths, allowing deeper penetration but resulting in lower resolution images.
They are suitable for inspecting thicker or denser materials.
High-frequency ultrasonic waves have shorter wavelengths, offering higher resolution but reduced penetration depth.
They are ideal for detecting small defects or inspecting thin materials.
We offer transducers with frequencies ranging from 5 to 400 MHz and optional focal lengths from 0.5 to 127.0 mm.
The scanning device and transducer scan the surface of the inspected product bit by bit, record the acoustic data of each point, and finally converge all the points into a complete 3D image through an algorithm.
Jeenoce’s ultrasonic microscopy supports your R&D process from development to validation, including process control, quality assurance, failure analysis, and reliability testing.
Detection type | Optical Inspection | ultrasonic microscopy (sam) | |
Inspection Focus | surface defect | Internal structural defects (2D/3D) | Internal and interface defects (3D) |
Resolution | 0.1μm | 1-10μm (decreases with thickness) | Submicron 1-5 μm (high frequency) |
Ideal Applications | Full surface inspection, high-speed in-line inspection | Internal inspection of solder joints / metal structures | Interfacial defects (e.g. delamination), non-metallic materials |
In semiconductor integrated circuit testing, yield rate is critical.
Jeenoce caters to the high-end electronics industry by offering both X-ray and ultrasonic inspection equipment.
Selecting the appropriate inspection method based on specific needs allows for optimized production capacity and maximized benefits.
Due to the high quality of our equipment and technology, you can inspect a wide range of products with significantly reduced maintenance costs, leading to a highly cost-effective return on investment over the equipment's lifecycle.
This ultrasonic inspection equipment is widely used in microelectronics, MEMS, solar energy, materials science, healthcare, military, aerospace, and automotive sectors.
It is particularly effective for high-end electronics, such as complex integrated circuits (ICs, VLSI, FPGAs, MCUs), where it assesses layer adhesion and structural integrity.
A-Scan | The transducer converts signals into A-Scan data, which serves as the foundation for analyzing all Scanning Acoustic Microscopes (SAMs). |
C-Mode | Captures a planar image of the product at a specific depth. |
Bulk-Scan | By acquiring an internal image of the product, we can determine the uniformity and continuity to find out whether the product is defective or not. |
PolyGate™ & Multi-Scan | Simultaneously scans multiple layers, collecting signals to generate a composite image. |
Q-BAM™ | Q-BAM™ visualizes internal structures and provides in-depth analysis using polarity and amplitude data, making it ideal for applications requiring both visualization and quantitative inspection, such as precision manufacturing, biomedicine, and materials research. |
B-Scan | Detects the pattern of a particular cross-sectional image of a product. |
Surface-Scan | Scanning of product surfaces and subsurfaces to investigate patterns of defects. |
AutoScan™ | A fully automatic scanning mode that can be programmed to acquire all necessary data in a single operation. |
THRU-Scan™ | Uses through-transmission ultrasound to detect macroscopic defects throughout the sample's thickness, ideal for quick assessments in industrial screening or large-scale quality control. |
3V™ | Generates three-dimensional images from existing ultrasound data. |
3D TOF | 3D TOF (Time of Flight) imaging uses ultrasonic propagation time to create a three-dimensional digital model of the object's interior. By accurately calculating the time of flight, it quantifies defect locations, making it ideal for high-precision inspections in aerospace and semiconductor industries. |
Multi-Axis Scan™ | A scanning mode designed for spherical or curved products. |
R-Scan™ | Cylindrical products are inspected by rotating the entire cylinder. |
STaR™ | STaR™ simultaneously assesses package integrity and internal connections using a standardized imaging approach, ensuring consistent product quality across global production lines and verifying transportation-related defects. |
Jeenoce offers a variety of imaging modes, including advanced options not commonly available, to ensure detailed and accurate analysis.
This allows you to select the most suitable mode for your specific needs, ensuring optimal imaging data.
The world's first commercially available ultrasonic scanning microscope was shipped in 1975
Over 20 patented innovations were developed between 1975 and 2005
Our ultrasonic inspection systems represent the standard for quality and accuracy
Our experience in ultrasonic microscopy far surpasses that of other testing providers.
Partnered with the world's top 10 semiconductor companies
Nine of the World's Top 10 Automotive Semiconductor Companies
Seven of the World's Top 10 Defense Contractors
Four of the World's Top 5 MEMS Manufacturers
Seven of the World's Top 10 300mm Wafer Companies
All of the World's Top 5 Semiconductor Storage Chip Manufacturers
We deliver the highest quality images and the most efficient, accurate results
Core components are sourced from our world-leading laboratory specializing in ultrasonic microscopy (ISO/IEC 17025 accredited)
Our patented inspection modes distinguish our equipment from competitors
More than 60 configurable options to suit most products
Our technology optimizes the inspection process, reducing inspection time and improving imaging efficiency
Real-time adjustments to parameters in response to product changes ensure high-precision inspections
In-depth data analysis supports retrospective studies and process optimization
We integrate multiple imaging modes to accommodate diverse testing environments and sample characteristics
Ensure consistent test results across different regions and equipment, maintaining quality standards
As a solution integrator, Jeenoce offers comprehensive, tailored solutions to meet your needs
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