Vacuum reflow soldering system with the lowest void ratio in the world
The vacuum reflow soldering process is increasingly recognized as a critical method for enhancing product reliability.
Through unique vacuum environment control, the void rate of solder joints can be controlled below 0.1%, which is especially suitable for the occasions with strict requirements of semiconductor LED packaging, IGBT power modules and so on.
The purpose of Jeenoce introducing the vacuum reflow soldering system which ranks world’s top three into SMT complete line solution is to provide high-quality welding solution to achieve zero-defect soldering quality for clients.
Why is the quality of vacuum reflow soldering system better?
Vacuum reflow soldering removes air in advance by vacuuming pumping. On one hand, it can reduce the probability of bubbles caused by oxidation.
On the other hand, it can reduce the occurrence of bubbles to a greater extent due to the pressure difference.
Therefore, vacuum reflow soldering is more suitable for the fields with high-quality electronic soldering needs such as military, medical and aerospace industries.
What does an excellent vacuum reflow soldering system possess?
Vacuum module
By creating a vacuum environment, the presence of oxygen is minimized, which significantly reduces the oxidation risk of solder materials and components.
Therefore the bubbles in solder points and the vacuum ratio can be eliminated and the quality and reliability of solder points can be enhanced.
Gradient temperature control module
Dozens of independent temperature controlling zones constitute a temperature control array to support delicate temperament management form -50℃ to 400℃, allowing an appropriate temperature range for the welding soldering process.
Transmission system
Design of the smooth conveyor belt ensures that circuit boards do not move or vibrate, maintaining the accurate positions of electronic components.
Control system
Powerful software control system can precisely adjust the temperature curve, vacuum degree and transmission speed, ensuring the yield rate of products.
Why is Jeenoce’s reflow soldering system the best?
The integrated vacuum soldering system of Jeenoce is from a German manufacturing plant whose brand ranks top three global brands.
Which has been committed to high-performance and high-reliability soldering equipment for centuries.
By continuously renovating new technology, it can not only offer customized solutions of vacuum reflow soldering for clients to meet specific needs of different industries, but also greatly reducing energy consumption and saving costs.
How much does a vacuum reflow soldering system generally cost?
As for the price of the vacuum reflow soldering system, it is a range quotation for Jeenoce’s integrated reflow soldering system.
The problem can be analogized to the price of a supercar whose price range cannot be sure ahead of time due to its customized configuration.
The cost of a domestically integrated system typically ranges from several hundred thousand to several million yuan, depending on factors such as the work area length, heating method, vacuum requirements, and other configuration parameters.
You can fill in the form according to your detailed requirements and we will contact you for further communication as soon as possible.
The applicable fields of reflow soldering system
Electronics Manufacturing: Ideal for producing High-Density Interconnect (HDI) circuit boards, LED lighting solutions, power modules, and more.
Automotive electronics industry: Providing reliable soldering for automotive electronic control units (ECU), sensors, etc.
Aerospace industry: Ensuring the quality of soldering joint quality in aviation electronic equipment and improving product reliability.
Medical devices industry: The system can be used to manufacture medical instruments and devices to ensure the security and reliability of products.
New energy industry: The system can be applied to the production of new energy products such as solar cells, lithium batteries and so on.
What are the differences between vacuum reflow soldering and nitrogen reflow soldering, ordinary reflow soldering?
The difference between vacuum reflow soldering and nitrogen reflow soldering lies in the ability to control void ratio.
The former one can reduce the void ratio to over 99%,while the latter one may leave a small amount of residual voids despite its filling nitrogen which can reduce the oxidation degree.
The difference between vacuum reflow soldering and ordinary reflow soldering lies in whether vacuum is drawn.
The latter one is usually soldered in air, which is prone to generate oxidation and voids, while the former one can significantly improve the quality of solder points by completely removing oxygen and moisture from the air.
How to ensure no voids in soldering?
Precise vacuum control, with a range of 10mbar to 100mbar, effectively removes gas from solder joints, ensuring high-quality connections.
By optimizing temperature curve: A reasonable temperature curve is key to ensuring welding quality. It is optimal to choose suitable stages of preheating, reflow and cooling stages according to components and solder.
Customize the structure according to the product: Design the tooling and conveyor system according to clients’ requirements to ensure the stable soldering quality of circuit board.
Soldering process monitoring: The reflow soldering system integrated by Jeenoce is from a German patented precision controlling system, which can supervise the temperature, vacuum degree and transmission speed to ensure the stability of the entire process.
Technical data
Work area length: 3150mm- 4900mm
Minimum temperature: -50℃
Conveyor track: 1-4 tracks (Iindividual customization can be fill in a form for communication)
Soldering stability: Minimum ΔT (ensuring uniform temperature)
Vacuum degree: 100mbar- 10mbar
Advantages of Jeenoce vacuum reflow soldering system
Provide optimal soldering configuration
The system supports adjustment of the number and layout of heating zones to meet the requirements of different soldering processes.
The design of conveyor belt support circuit boards of different sizes,ranging from small prototypes to large production line.
Adjust temperate cure according to different types of welding materials and components types to ensure soldering quality and efficiency.
The system adopts modular design to facilitates changes, upgrades or modifications, and extends the device life cycle.
Lowest total cost of ownership
Rducing rework and scraping costs and increase of production efficiency by precise technology control.
Decrease of electrical energy consumption and lower operating costs by the efficient heating and cooling system.
Some decrease of maintenance frequency and cost with firm structure of devices and the small number of movable components.
Ensure long-term and stable usage life of devices with reliable materials to extend its service life.
Green production
The vacuum environment can diminish pollution of oxidation, volatile emissions and carbon emissions to nature.
Comply with international environment protection regulations and supporting enterprises in achieving sustainable development.
Decreasing remains after soldering and the demand for chemical cleanser to further decreasing environment impact.
Short downtime and efficient production
The unique sleeping setting can allow reflow oven to resume production instantly.
The stable low-energy consumption operation state saves a lot of time.
Significant savings in energy consumption and cost expenditure.
Simple equipment maintenance
The device components can be replaced independently to simplify maintenance process and reduce downtime.
Open design is convenient for inspection and cleaning, reducing maintenance difficulty.
Maintenance process does not require complex tools or professional training, reducing labor cost.
Powerful software control system
Supporting precise temperature distribution control in multiple heating zones to ensure the uniformity of soldering.
The closed-loop control system can accurately adjust vacuum degree to optimize the welding conditions.
Adjusting transmission speed according to types of circuit boards to ensure process stability.
Supporting multiple process recipes for convenient and rapid switching of production tasks.
Providing functions of data recording and real-time monitoring, and supporting process optimization and quality traceability.
Central support technology
The design of central support can effectively prevent circuit board from deforming or moving during the soldering process.
Suitable for rather large or heavy circuit boards, meeting diverse production requirements.
Reducing the problems of solder bridges or open circuits caused by movement of the circuit boards to ensure high-quality welding joints.
Residue management system
Reducing or eliminating the need for flux to lower the residues on the circuit boards.
Effectively removing smog and particles to reduce the accumulation inside the equipment.
The design of the equipment reduces cleaning need and extends maintenance cycles.
High-quality soldering without voids
The vacuum environment can completely eliminate soldering voids to enhances connection reliability.
High-quality welding points can extend production usage life and reduce the failure rate.
Meeting the strict requirements of the high-reliability industries such as aerospace, automotive electronics, military and so on.
Fantastic technical capabilities and service experience
Jeenoce positioning solution integrator can provide one-stop intelligent upgrade solution from software to hardware,delivery and maintenance based on your requirements.
The service embraces pre-sales communication, problem-solving, solution-presenting, project-undertaking, inspection, delivery and after-sales problems, which is a whole-process accompanied service.
