Suzhou, November 28. 2025 – According to the latest data released by market research firm Omdia, global DRAM (Dynamic Random Access Memory) sales reached a record $40.3 billion in the third quarter of 2025. representing a 30% quarter-on-quarter increase. This remarkable growth was primarily driven by sustained DRAM price increases and strong investment in artificial intelligence (AI) infrastructure, particularly the explosive demand for High Bandwidth Memory (HBM). The global DRAM market is currently in a structural upcycle, with supply chain shortages intensifying due to explosive data growth driven by AI inference demands, resulting in DRAM inventory cycles shortening from 3.3 weeks to just 2.7 weeks.
In terms of market share, SK Hynix maintained its leading position with a 34.1% share, despite a 5.3 percentage point decline from the previous quarter, marking its third consecutive quarter at the top. Samsung Electronics followed closely with a 33.7% share, up 0.5 percentage points quarter-on-quarter, while Micron Technology ranked third with a 25.8% share, gaining 3.8 percentage points. HBM has become a critical competitive factor, and SK Hynix’s significant leadership in this segment has enabled it to sustain its overall market dominance. Cross-verification data from TrendForce shows global DRAM revenue at approximately $41.4 billion, up 30.9% quarter-on-quarter, largely consistent with Omdia’s report.
From a historical perspective, SK Hynix surpassed Samsung for the first time in the first half of2025 with a 36.3% market share — a milestone shift in over 30 years. As early as Q3 2023. SK Hynix had already reached a historical high of 35% market share, largely benefiting from major HBM orders from customers like NVIDIA. It currently holds around 70% of the HBM market. Samsung, meanwhile, is shifting its strategy from market share expansion to profitability optimization through capacity expansion at its Pyeongtaek Line 4 and Line 5 facilities. Micron is expected to increase its HBM market share to 22–23%, while Chinese manufacturer ChangXin Memory Technologies (CXMT) is rapidly expanding, with its market share rising from nearly zero in 2020 to 5% currently, and is projected to reach 15% in the future.
Analysts forecast that in 2026. the average selling price (ASP) of DRAM will rise by 53%, and NAND by 44%, further enhancing industry profitability. Notably, SK Hynix’s entire HBM production capacity for 2026 has already been fully booked, underscoring robust market demand. Global DRAM production remains concentrated in South Korea (Samsung, SK Hynix), Taiwan, China, the United States, and Japan, with intensifying competition in the landscape.
As a technology-driven enterprise focused on digital SMT (Surface Mount Technology) full-line integration and non-standard automation solutions, Suzhou Jeenoce Electronic Co., Ltd. (hereinafter referred to as “Jeenoce”) closely monitors global semiconductor market dynamics. We believe this market growth presents tremendous opportunities for high-end EMS (Electronics Manufacturing Services) customers. Jeenoce will continue to integrate core product lines such as SMT and semiconductor packaging, along with ERP and MES digital systems, to build an efficient delivery platform that helps customers address the challenges of personalized intelligent manufacturing.
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