Industry dynamics-

What are the functions of dispensing machines in industrial production?

A dispensing machine is a machine equipment used for dispensing and applying glue, which is widely used in the electronics and LED industries. A dispensing machine, also known as a glue coating machine, a glue dripping machine, a glue dispensing machine, a glue filling machine, etc., is specifically...

212024-05

Precautions for measuring reflow soldering temperature curve

When measuring the temperature curve of reflow soldering, a temperature curve tester (hereinafter referred to as a thermometer) is required. Its main body is a flat metal box, and the end socket is connected to several micro thermocouple probes with thin wires. When measuring, solder, adhesive, and...

202024-05

Discussion on the role of X-RAY in BGA detection

China's electronic technology is developing rapidly, with electronic PCBA processing and packaging showing a trend of high-precision new miniaturization. The quality requirements for circuit assembly such as SMT surface mount processing and plug-in processing are becoming increasingly high. Ther...

202024-05

What are the performance advantages of thermal conductive adhesive dispensing?

In enterprise production, thermal adhesive dispensing machines can use various dispensing equipment with different application properties to assist in production operations, allowing different automated dispensing solutions to have a wider range of usage space, allowing equipment to calmly handle hi...

202024-05

The principle and characteristics of vacuum reflow soldering

Background of vacuum reflow soldering technology: The development of electronic technology has made electronic components smaller and smaller, with higher power and higher integration of chips. The application of BGA, CSP, QFN and other components in packaging of products such as semiconductors, hig...

172024-05

The principle of X-ray inspection in PCB assembly

X-ray detection technology, commonly known as Automatic X-ray Inspection (AXI), is a technique used to examine hidden features of target objects or products using X-rays as a source. Nowadays, X-ray testing is widely used in many fields such as healthcare, industrial control, and aerospace. As for P...

172024-05

How to solve the problem of uneven solder paste dispensing and wire drawing?

Because it is rare in practical life, many people are not particularly familiar with the solder paste dispensing process. However, this process plays a very important role in the manufacturing industry and is widely used in the automotive, mobile phone parts manufacturing, and semiconductor industri...

172024-05

How to set the reflow soldering temperature

The most important factor in setting the reflow soldering temperature is still based on the characteristics of the solder paste, and each type of solder paste is given a parameter value. In addition to the temperature parameter values for reflow soldering, we also need to consider environmental fact...

162024-05

BGA packaging device solder joint defects

BGA packaging technology has a series of advantages, such as a large number of pins, large I0/terminal spacing (up to 1.00 mm, 1.27 mm, 1.50mm), small inductance and capacitance between leads, enhanced electrical and heat dissipation performance, etc. Therefore, it has developed rapidly and has been...

162024-05