JEENOCE's X-ray Inspection Equipment provides a reliable guarantee of the quality of your products, reducing product returns and associated costs and reputational damage.
Jade Plus inspects the hidden regions of your products which are inaccessible to optical tools.
Spot quality process trends early using advanced measurement tools for distance measurement and voiding.
Ensure IPC-A-610 and IPC-7095 compliance with built in checking for BGA and QFN voiding, solder ball diameter, roundness, bridge and missing.
See assembly defects clearly with 0.95 µm image resolution.
Measurement
Screen for solder pad defects quickly with automated voiding measurement.
See what you are inspecting and move to parts quickly with the Component Location feature.
Jade Plus gives a unique insight into your product quality.
Advanced measurement functions, included as standard, turn X-ray images into quantitative data that you can use to spot emerging quality trends early, before it’s too late.
In-built tools for dimension measurement, BGA void analysis, bump diameter and roundness and through hole filling make quick work of finding and characterizing defects, helping you achieve IPC-A-610 and IPC-7095 compliance.
Enjoy high throughput even with a high mix of products.
Save time inspecting multiple boards.
Program an automated inspection routine once, then load, click and go.
See from every side at high magnification.
Nordson DAGE’s unique double angle geometry does not rotate the board so you never lose orientation.
Click to jump directly to a specific part.
Component Location uses board design data so you always know what you are looking at.
Jade Plus features an open X-ray tube with a replaceable tungsten filament.
Designed with maintenance in mind so you can be up and running fast, whenever the filament defocuses or expires.
Tungsten filaments fade over time, however you can experience ‘as new’ performance at any time by swapping in a new filament.
Training included, to minimize the risks of contaminating or damaging the X-ray tube during filament changes.
For a maintenance free alternative, consider Quadra® 3 which requires no filament changes, ensuring ‘as new’ uninterrupted performance for life.
Never loose your way
To prove your quality with confidence you need the highest quality tools.
See what you are inspecting and move to parts quickly with the Component Location feature.
See what you are inspecting and move to parts quickly with the Component Location feature.
4-way split screen view makes it easy to compare components and evaluate views from different angles.
3D visualization of BGA solder balls using optional µCT accessory.
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