Industry dynamics-

Common knowledge on the application of automatic dispensing machines

The large and medium-sized automatic dispensing machine with excellent high-speed dispensing characteristics has a three-dimensional effect on indoor space, and the programmable controller dispensing path passes through. The powerful automatic dispensing function is applied to carry out dispensing a...

182024-04

Reflow welding machine heating system parameter indicators

The heating system parameters of the reflow welding machine mainly include the number of heating temperature zones, temperature characteristic parameters, power consumption parameters, etc. JEENOCE would like to share in detail the parameters and specifications of the reflow welding machine heating...

172024-04

What is the reason for the formation of bubbles in BGA welding?

BGA is an essential part of electronic components, but in BGA packaging and welding, voids often occur. The formation of voids is mainly due to the high-temperature cracking of organic compounds in the flux, causing gas to be trapped in the alloy powder, forming voids. The formation of voids can to...

172024-04

The difference between piezoelectric injection valve and pneumatic injection valve

The dispensing machine equipment can be equipped with many dispensing valves for dispensing, including jet valves, spiral valves, diaphragm valves, screw valves, high-precision dispensing valves, etc. However, when selecting dispensing machine equipment, it is necessary to consider the field regulat...

172024-04

Reasons for component misalignment after reflow soldering

The phenomenon of component misalignment or misalignment after reflow soldering may be caused by poor wetting of the solder or comprehensive factors such as equipment. Observing the occurrence time of defects can be divided into two situations for analysis and resolution.1、 Component misalignment b...

162024-04

BGA solder bubble detection for PCBA circuit boards

PCBA circuit board bubbles:During the SMT soldering process of PCBA circuit boards, bubbles are inevitable in the solder balls during BGA soldering. There is a specified standard in the industry for the size of the bubble area of the solder balls, which is to ensure that the product avoids or reduce...

162024-04

Common problems with the use of dispensing valves

The dispensing valve is one of the indispensable spare parts in the operation of the automatic dispensing machine. How to solve the problems encountered by the dispensing valve during the entire process of the automatic dispensing machine? JEENOCE has summarized the following points for you:1. The d...

162024-04

Reasons and solutions for cold soldering and false soldering in reflow soldering

During the reflow soldering process, there may sometimes be some problems that affect product quality, and cold soldering false soldering is one of the more common adverse phenomena. JEENOCE will introduce the reasons and solutions for reflow soldering and false soldering.1、 Reasons and Treatment o...

152024-04

The difference between X-ray and gamma rays in non-destructive testing equipment

Non destructive testing equipment uses X-ray for penetration testing operations, which is different from gamma rays. Essentially, both belong to radiation, but there are differences in strength, as follows:Gamma rays are a type of strong electromagnetic wave, with a wavelength shorter than X-rays, g...

152024-04