XRAY detection equipment for detecting PCBA solder joints

In the processing of PCBA, due to the unreasonable PCB design, problems such as poor BGA soldering are often encountered. Bubble holes are a common defect that may lead to loose or cracked solder joints, thereby affecting the performance and reliability of the entire circuit board.

However, after BGA packaging, it is difficult to see the soldering of the bottom tin balls, which makes it difficult for many technicians to conduct qualitative analysis of the product, especially when the product has unstable or abnormal performance.

By using XRAY detection equipment and utilizing the characteristics of X-rays penetrating the product, the flat panel detector can receive the penetrating rays to form an image, enabling the detection of BGA welding defects in PCBA without damaging the product.

XRAY detection equipment is a very effective method for high-precision and high-resolution detection of BGA solder joints on PCBA circuit boards, detecting the quality of BGAA solder joints, including voids, virtual solder joints, and missed solder joints. By analyzing X-RAY images, the area of bubble voids in BGA solder joints can be measured, and then the proportion of bubble voids, i.e. the ratio of bubble void area to solder joint area, can be calculated.

Usually, the smaller the bubble to cavity ratio, the better the welding quality and reliability. On the contrary, the larger the bubble to void ratio, the poorer the welding quality, which may lead to problems such as loose and fractured solder joints.

In summary, XRAY detection equipment is very effective in detecting BGA soldering in PCBA circuit boards. Whether it is measuring the bubble void ratio or other solder joint conditions, XRAY detection technology is used to detect the welding quality without damaging the PCBA board, ensuring the reliability and performance of products. Nowadays, more and more manufacturers are using this technology for BGA solder joint detection.