Do the bottom filling process have any performance requirements for the dispensing machine?
Release time：2024-01-31Publisher:Jeenoce
What is the bottom filling process?
The bottom filling process is to apply epoxy resin adhesive dots on the edge of the inverted chip, and through the capillary effect, the adhesive is sucked to the opposite side of the component to complete the bottom filling process. Then, the adhesive solidifies under heating.
Do the bottom filling process have any performance requirements for the dispensing machine?
1、 The bottom filling first requires heating the glue to maintain its temperature, so our dispensing machine equipment must have thermal management function.
2、 The bottom filling process requires heating of the components, which can accelerate the capillary flow rate of the adhesive and provide favorable guarantees for normal curing.
3、 The bottom filling process also requires high precision in dispensing, especially when the RF shielding cover has been assembled in place, and dispensing operations need to be carried out through the holes on top.
