Factors affecting the stress of the splitting machine

From a physical perspective, we can understand that when a material cannot produce displacement under external forces, its geometric shape and size will change. This deformation is called strain.

When the material deforms, an equal but opposite reaction force is generated internally to resist external forces. The concentration of distributed internal forces at a certain point is called stress. In short, the internal force per unit area at a certain point in the cross-section under study is called stress, the normal of the cross-section is called normal stress or normal stress, and the tangent of the cross-section is called shear stress. Or shear stress.

Firstly, like some knife type PCB splitters, the PCB substrate does not move during the cutting process and the circular knife slips. This can ensure that the electronic components of the substrate are not damaged due to movement, and it is also a factor affecting the stress of the separator. In addition, it is possible to adjust the sliding speed of the circular knife, the depth of the V-groove, the loss of the tool, and the precise adjustment of the spacing between the upper circular knife and the lower straight knife, all of which have effects. The stress magnitude of the separator.

Secondly, everyone uses a PCB splitter to minimize stress, thereby avoiding PCB breakage and other damage caused by the separation process. Some board splitting machines complete board segmentation by crossing V-shaped grooves. The cutting speed is controlled by a knob. The circuit board splitting stroke can be freely set and comes with an LCD display screen. These are also factors that affect the stress of the PCB board splitting machine.