IC chip detection methods and X-RAY?

IC chips are composed of a large number of microelectronic components, so they are also known as integrated circuits. A small chip, but with so many electronic components gathered, the difficulty of detection can be imagined. Nowadays, X-ray detection is widely used in various industries. What will its application be on IC chips? What is the difference with traditional detection methods? Let's take a look together.

Chips are increasingly pursuing miniaturization and low-power design, with increasingly precise circuits and increasing difficulty in detection. The traditional detection method for chip peeling is to peel the chip layer by layer and then use a microscope to detect surface defects on the chip. This method not only lacks comprehensive defect detection, but also causes damage to the chip.

And X-RAY detection is different. X-RAY detection uses X-ray penetration technology, which penetrates the chip and creates an image. Any defects inside the small chip are clearly visible and will not be damaged.

After the discovery of X-RAY non-destructive testing, people have abandoned the traditional peel off chip testing method. In addition to chip non-destructive testing, X-RAY can also non-destructive detect defects in LED beads, semiconductors and other products.