Industry dynamics-

Common process defects and solutions of fully automatic dispensing machines

With the widespread application of electronic glue, the application of dispensing equipment will also become more extensive and diversified. The daily use of a dispensing machine has a significant impact on its service life, including the smoothness of its use. The following are some common problems...

212024-03

How many temperature zones are set for lead-free reflow soldering

The melting point of lead-free solder paste is 217 degrees, and the common composition of lead-free solder paste is: Sn/Ag/Gu, with a ratio of 96.5/3.0/0.5. Taking tin silver copper solder paste as an example, what is the temperature range set for lead-free reflow soldering?1、 Temperature setting o...

202024-03

X-RAY high-precision detection of bubble defects in BGA solder joints

In the field of modern PCB design, the use of BGA and other area arranged components has quickly become standardized. In order to ensure the accuracy and qualification rate of assembly, traditional detection methods are no longer sufficient. By introducing X-RAY detection equipment to meet the detec...

202024-03

How to solve the problem of unstable dispensing volume in fully automatic dispensing machines?

The dispensing machine uses compressed air to feed the glue bottle (syringe) into the feed tube connected to the piston chamber, and controls the up and down movement of the piston to achieve dispensing.The opening/closing of the solenoid valve controlled by the pneumatic dispensing machine can adju...

202024-03

Key points for setting the temperature of lead-free reflow soldering

The lead-free reflow soldering process has also become the main process in the manufacturing and welding of electronic products. The design of lead-free reflow soldering equipment must be modified to meet lead-free requirements, and heat sensitive components in the machine must be modified or measur...

192024-03

X-RAY detection of welding seam defects in mechanical parts

Mechanical component welding is the process of joining metals or other materials through high temperature heating or high pressure to achieve integration, such as steel welding, aluminum alloy welding, PCB welding, etc. Welding process is an indispensable manufacturing technology in modern industria...

192024-03

What is the difference between a visual dispensing machine and a regular dispensing machine

In recent years, the development of automation equipment has been rapid, and the technology of dispensing machines in the electronic manufacturing industry has been constantly breaking through. Various supporting facilities of dispensing machines are constantly upgrading, and the functions of dispen...

192024-03

How to reduce reflow soldering of solder beads

Generally speaking, the reasons for the formation of solder beads after reflow soldering are multifaceted and comprehensive. The printing thickness of solder paste, the composition and oxidation degree of solder paste, the production and opening of templates, whether the solder paste absorbs moistur...

182024-03

X-RAY Rapid Detection of Bubble Area on PCBA Circuit Board

During the welding process of PCBA circuit boards, BGA solder balls are prone to some degree of bubbles, also known as solder ball holes. In the industry, technical indicators have clear requirements for the size of solder ball bubbles to ensure the stability of the product in later consumption.Tin...

182024-03