X-RAY high-precision detection of bubble defects in BGA solder joints

In the field of modern PCB design, the use of BGA and other area arranged components has quickly become standardized. In order to ensure the accuracy and qualification rate of assembly, traditional detection methods are no longer sufficient. By introducing X-RAY detection equipment to meet the detection requirements, X-RAY is a device that can penetrate light and be used to detect bubble defects in BGA solder joints, bubbles, IC chips, semiconductors, and other areas. By detecting solder joint defects, hidden solder joint defects in products can be detected early. At present, early detection of product defects can effectively prevent problems that may arise during subsequent use of the product.

Generally speaking, BGA solder joint defects mainly include: empty welding, cold welding, missed welding, false welding, etc. X-RAY can achieve a very intuitive detection effect for solder joint bubbles.

For the defects in BGA,JEENOCE found through X-ray detection that there are often the following problems:

empty

Hollow solder joints are caused by impurities in the tin material or substandard solder quality. Although there are bubbles in BGA solder joints, if the bubble area does not exceed 20% of the solder joint diameter, it is considered unqualified;

Tin bridge and short circuit

When there is too much solder at the contact point or when the solder is not placed properly, bridging and short circuits often occur;

Misalignment

The X-ray image will clearly show whether the BGA ball is not properly aligned with the solder pads on the PCB. Misalignment is not allowed.

Open circuit and cold solder joints

Open circuits and cold solder joints occur when the solder does not come into contact with the corresponding solder pads or when the solder flows improperly. This situation is not allowed.

No contact

Once the components have been mounted on the PCB, missing or misplaced solder and solder balls are not allowed.