X-ray detection IC chip

Speaking of the ubiquitous IC chips around us, many people must not be familiar with it. For example, the chips in mobile phones, TVs and computers we use every day are actually IC chips. It is translated into Chinese, that is, integrated circuit. The structure of IC chip is that a large number of microelectronic components, such as capacitors and integrated circuits formed by resistors, are placed on the substrate to make chips.

How is IC chip made?

It should be noted that IC chips are mainly composed of countless micro electronic devices and parts, so they are very accurate. Through the corresponding production process, the transistors, resistors, capacitors, diodes and other components required in the circuit are connected with the wiring to make a small or even several small semiconductor chips or dielectric substrates, which are then packaged in the shell to become a microstructure with the required circuit functions.

Disadvantages of traditional chip detection.

In the whole production process, all components form a whole in structure, which makes the electronic components a big step towards miniaturization and low power consumption, and has higher reliability. But at the same time, the corresponding problems appear. The more accurate the circuit is, the more difficult it is to detect. At present, the chip detection in our country often adopts the method of peeling off the chip layer by layer, and then use the electron microscope to photograph each layer of the surface of the chip. This traditional detection will cause certain damage to the chip. This embarrassment was not completely solved until the appearance of X-ray nondestructive testing equipment.

Advantages of X-ray detection:

As the mainstream detection in the current market, X-ray detection mainly uses X-ray generated by X-ray detection equipment to irradiate the chip surface. Due to the strong penetration of X-rays, the image can be formed after penetrating the chip, making the internal defects of the chip clear at a glance. In addition, X-ray does not damage the chip detection, so it is also called non-destructive testing. In addition to chip detection, defect detection of lithium batteries, led beads, semiconductors and other products can also be carried out through it.

Principle of X-ray detection:

X-ray detection equipment penetrates the interior of the product through strong pressure electrons and generates images. X-ray testing equipment penetrates the sample and detects the internal defects of the sample, which is one of the current nondestructive methods to detect internal defects effectively and quickly.