Application of automatic milling cutter dividing machine in PCB manufacturing process

The microcomputer is used to control automatic feeding and plate splitting, which is convenient for cutting various cob substrates, spherical LED aluminum substrates, cob ceramic plates, etc. the efficiency is 5-6 times faster than that of the traditional plate splitting machine. The micro stress on components during cutting is about 200 to prevent damage to precision components. The air mixing design, double straight knife splitting, is especially suitable for cutting precision PCB boards. The guillotine type work is suitable for mpcb of various thicknesses, and the plate cutting stroke is less than 2nm.

For the double-sided and multi-layer printed circuit board of milling cutter dividing machine, the double-sided board can not adapt to the design of complex circuits by means of rivets, and the efficiency is too low. It is powerless to conduct multi-layer boards. The multilayer of circuit board is the inevitable result of the function upgrading of electronic products. How to achieve high reliable conduction between multilayer boards has become an important technical problem to be solved. In this way, the technology of using chemical method to realize the hole metallization of non-metallic printed circuit board also came into being. The conduction between the two circuit surfaces of the earliest PCB double-sided printed circuit board gave birth to the small hole metallization technology. This is also the earliest industrialized resin surface plating technology. The progress of this technology has improved and developed the electroless copper plating technology. At present, all kinds of electronic products, such as personal computers, smart phones, smart electronic wearable products, electronic instruments, vehicle satellite navigation devices, vehicle drive parts and other circuits, all use PCB circuit boards. With the requirements of the design trend of electronic product function diversification, volume miniaturization and mass lightweight, the increase of small parts QFP, SOP, BGA, CSP, pop, 01005 and other fine spacing and high-density electronic components on PCB also increases the use of more layers of PCB, and also increases the use density of parts on PCB. As a result, in the process of R & D, manufacturing, packaging, transportation and user use of these PCB electronic products, defective products are often produced, resulting in a decline in product quality. Under these external factors, in order to improve product quality and better understand product characteristics, it is necessary to transform, upgrade and optimize the production equipment and process flow of the full-automatic board splitting machine in the electronics factory.

As we all know, radio communication developed very rapidly in the Second World War. Radio communication plays an important role in the acquisition and transmission of war information. So much so that in the Second World War, the electronic communication technology and the corresponding product development and manufacturing received special attention, and finally formed a new industry, which was far ahead of the development of other industries. A remarkable feature of the development of radio technology is the miniaturization of electronic devices and the continuous upgrading of circuit technology. The most obvious example is from the development of vacuum tubes to transistors to the application of integrated circuits. With the development of these technologies, the connection technology of discrete components in bulk has changed to the printed circuit board technology. In the tide of developing China's economy, SMT electronic manufacturing industry has risen rapidly in Central China.

The rapid development of electronic technology, the growth of production costs and the harsh living environment of enterprises have led to increasingly fierce market competition in the electronic industry, forcing electronic enterprises to seek more energy-saving, more efficient and smarter operation solutions to reduce costs and improve product quality at the same time. The introduction of high-precision automation equipment (SMT fully automatic dividing machine) by the electronics factory reduces manual participation and improves product quality and consistency.