What are the components of reflow soldering equipment?

Reflow soldering equipment usually consists of the following parts:

1. Heating system: The heating system is the core part of reflow soldering equipment, mainly composed of preheaters, heaters, and coolers. Preheaters are used to preheat PCB boards to a certain temperature to reduce heating time and heat loss during soldering; The heater heats the solder paste and flux to a certain temperature, so that they can evenly coat the surface of the dry solder joint; The cooler is used to cool the PCB board to a stable temperature.

2. Peak system: The peak system is a device used to control the application of solder paste and flux on the surface of solder joints. It usually consists of a peak pump, a peak probe, and a peak control circuit. The peak probe is used to connect the peak control system to the PCB board in order to control the height and shape of the peak; The peak pump is used to generate and control the pressure and flow rate of the peak; The peak control circuit is responsible for controlling the generation and adjustment of peaks.

3. Control system: The control system is used to control the entire process of reflow soldering equipment, including heating, peak, cooling, and other operations. It usually consists of electronic controllers, sensors, display screens, and communication interfaces.

4. Cooling system; The cooling system is used to cool the PCB board to a stable temperature. Usually includes air cooling systems and water cooling systems, etc,

5. Conveyor system: The conveyor system is used to transport PCB boards to reflow soldering equipment for soldering, usually consisting of conveyor belts, electric rollers, and electromagnets.