What is the role of the heating system in fully automatic reflow soldering

Automatic reflow soldering is widely used in the electronics industry. It allows the solder on both sides of the component to melt and bond with the motherboard. What heating technology is used in the heating system?

1. The heating system is precisely controlled by a computer and PLC, and automatically controls the heat generation through PID intelligent calculation. The fuzzy control function adds overshoot and suppression functions, and quickly responds to external heat changes. It quickly responds to external heat changes and ensures a more balanced temperature through internal control; Equipped with temperature deviation, fault diagnosis, and sound and light alarm functions; The upper furnace body can be opened as a whole, facilitating furnace cleaning.

2. The heating system adopts Taiwan Exhibition's dedicated heating wire heating technology; Adopting imported high current solid-state relay contact output, safe and reliable, equipped with SSR heat sink, greatly improving heat dissipation efficiency and effectively extending its service life;

3. All heating components are made of imported high-quality components, ensuring high stability and reliability of the entire system, and ensuring a longer service life; Combined with the PID fuzzy control function of PLC, it directly monitors the changes in external temperature and heat value, controls the heating device with small pulses, quickly responds, and ensures temperature control accuracy of ± 2 ℃. The internal temperature distribution error is within ± 5 ℃, and the temperature distribution in the length direction meets IPC standards.

Reflow soldering technology is not unfamiliar in the field of electronic manufacturing. The components on various boards used in computers are soldered to the circuit board through this process. This equipment has a heating circuit inside, which heats air or nitrogen to a sufficiently high temperature and blows it towards the circuit board where the components have already been attached, allowing the solder on both sides of the components to melt and bond with the motherboard. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during the welding process, and manufacturing costs are also easier to control.