X-ray is required to determine the quality of BGA welding in PCBA processing

With the continuous development of electronic packaging technology and the increasing demand from users, BGA packaging devices are developing towards close range and miniaturization. The commonly used BGA spacing has reached 0.4 pics, and the minimum spacing has reached 0.3 pics. The increasing number of chip pins has brought new challenges to electronic installation processes, The difficulty of controlling BGA components during reflow soldering is increasing, and virtual soldering problems are prone to occur, which brings serious quality problems to the products.

As is well known, with the continuous development of the electronic information industry, PCB products are also rapidly developing towards ultra-thin, small components, high density, and fine spacing; The assembly density of components on a unit PCB is increasing, with line width, spacing, and solder pads becoming smaller and smaller, reaching the micrometer level. The number of composite layers is also increasing, and the quality requirements of the client are constantly improving; Chip components have reached the size of 03015, and the precision requirements for manufacturing processes and mounting inspections are becoming increasingly high.

Virtual soldering is commonly known as cold solder, where the surface appears to be well soldered, but the interior is not actually connected, or in an unstable intermediate state that may or may not be connected. Some are caused by poor soldering or insufficient soldering, resulting in the lack of conductivity between the component pins and solder pads. Other reasons include oxidation or impurities on component pins and solder pads, which make it difficult to visually detect solder joints on PCBA. In this case, an X-ray inspection machine is needed. Its advantage is that it can directly detect the interior of the circuit board through X-ray, without dismantling or damaging the internal structure. It can clearly present defects that are not visible to the naked eye in the detection image. It is a commonly used BGA welding detection equipment by PCBA processing manufacturers.

X-ray meets the various motion requirements of customers for workpiece detection, with a strong penetrating radiation source paired with high-resolution flat panel detectors to meet diverse detection needs; High system magnification, high-definition real-time imaging; Paired with an eight axis linkage system, it can operate and detect in multiple directions without dead angles, ensuring the quality of image acquisition and detection accuracy.