Can X-ray testing detect false soldering short circuits in the BGA soldered on the PCB?

PCBA has become an irreplaceable component in the electronic market, covering almost every electronic related industry. Its characteristic is to use circuit boards to process the many and chaotic circuits of the past, greatly reducing product size and pushing products to a more modern level. Of course, higher technology also brings higher technical standards.

Having requirements is good, but companies may encounter some problems during the actual processing, such as virtual welding, false welding, and empty welding. The worst case scenario is missed welding. For missed welding, some may be detected by visual inspection in a timely manner, but for false welding and empty welding, it cannot be achieved in a timely manner.

Internal defects cannot be directly detected using visual inspection or AOI instruments. Currently, X-RAY detection equipment is commonly used, and its powerful penetrability can detect internal structural defects of the product, such as empty welding, virtual welding, false welding, bubbles, and other abnormalities.