Defects caused by improper adjustment of reflow soldering furnace process

Most of the poor reflow soldering is caused by poor printing and SMT in the front. There are also adverse phenomena caused by improper adjustment of reflow soldering process. JEENOCE mainly introduces what are the adverse effects of reflow soldering caused by improper adjustment of the four temperature zones of reflow soldering.

1、 Reflow soldering preheating zone: If the temperature rises quickly, it will cause the reflow soldering point to stand on a monument and solder beads; If the temperature rises slowly, consider the impact on the entire time;

2、 Reflow soldering constant temperature zone: If the temperature zone is too long, it will cause the reflow soldering point to not light up; If the temperature range is too short, it will cause the reflow soldering point to stand on a monument and cause false soldering;

3、 The highest temperature zone for reflow soldering: If the temperature is too high, it can cause yellowing and damage to the components and PCBs; If the temperature is too low, it will cause non melting of tin and the solder joints will not be bright;

4、 Reflow soldering and soldering zone: If the temperature zone is set too long, it will cause yellowing and damage to the original components and PCB; If the temperature range is set too short, it will cause non melting of tin and the solder joints will not be bright;

5、 Reflow soldering cooling zone: If the cooling is too fast, it will cause damage to the components and the tin dots to break; If the cooling is too slow, it will cause a large crystal structure, rough solder joints, and lack of brightness.