Characteristics of lead-free reflow soldering points
Release time：2024-02-27Publisher:Jeenoce
Today, JEENOCE brings us relevant knowledge about lead-free reflow soldering. Let's take a look at the characteristics of lead-free reflow soldering joints!
1. The main characteristics of lead-free reflow soldering
(A) High temperature and melting point reflow soldering is about 34 ℃ higher than traditional lead eutectic solder.
(B) High surface tension and poor wettability.
(C) The process window is small, and quality control is difficult.
2. Characteristics of lead-free reflow solder joints
(A) Poor infiltration and poor expandability.
(B) The appearance of lead-free reflow solder joints is rough. Traditional inspection standards and AOI need to be upgraded.
(C) There are many air holes in lead-free reflow soldering points, especially when the lead solder end is mixed with lead solder, the lead solder on the solder end (ball) is melted first, covering the solder pad, and the flux cannot be discharged, causing air holes in the sunlight room. But pores do not affect mechanical strength.
(D) Multiple defects - due to poor wettability, the self localization effect is weakened.
