Scope of application of X-RAY non-destructive testing

X-ray testing equipment, also known as X-ray perspective testing equipment or X-ray non-destructive testing equipment, releases X-rays during operation, which can quickly penetrate the interior of the object to be tested, identify the internal structure, and project imaging.

Technicians only need to learn how to analyze images to have a good understanding of the internal structure of products and distinguish and place defective products.

SMT specific X-ray testing equipment is widely used in the SMT electronic manufacturing industry. It uses X-ray for non-destructive testing and provides real-time internal inspection analysis, providing quality inspection basis for PCB, SMT assembly, semiconductor, lithium battery testing, solar energy, LED packaging, and so on.

At present, X-ray non-destructive testing is mainly used for the following points:

1. BGA, CSP, FLIP CHIP, COB, QFN, QFP, and PTH plugin quality inspection, etc;

2. Detection of PCB board welding conditions, such as open circuits, empty soldering, etc;

3. IC packaging testing;

4. Detection of electronic components such as capacitors and resistors;

5. Internal inspection of metal components;

6. Detection and testing of electric heating tubes, lithium batteries, precision instruments, etc;