How can the chip after packaging be better detected?

When it comes to IC chips, many people are not unfamiliar with them. For example, the phones, televisions, and computers we use all contain chips, which are actually integrated circuits. IC chips are a piece of chip made by processing a large number of microelectronic components such as capacitors and resistors on a substrate through technology.

How are IC chips made?

IC chips are composed of countless micro electronic devices and components, therefore, their precision is beyond doubt. By using corresponding manufacturing techniques, the components and wiring required for a circuit, such as transistors, resistors, capacitors, and diodes, are interconnected and made onto a small or even a few small semiconductor chips or dielectric substrates. They are then packaged in a shell to form a microstructure with the required circuit functions.

Traditional chip detection methods

All components are structurally packaged as a whole, taking a big step towards miniaturization, low power consumption, and high reliability of electronic components. The more precise the circuit, the higher the difficulty of its detection. At present, in China, when testing chips, the usual method is to peel off each layer of the chip and then use an electron microscope to capture the surface of each layer of the chip. This traditional detection method will bring certain destructive effects to the chip.

New chip detection methods

The internal detection method of chips is to use scientific technology to analyze it internally. CT and X-RAY are popular detection methods on the market, which are very suitable for enterprises that require high product requirements and high product failure rates. Through powerful internal penetration technology, they can effectively transmit the inside of the product, and then the detector converts the received signal into an image on the display.