Application fields of injection valves

In today's microelectronics industry, especially in the consumer electronics industry, product volumes are becoming smaller and smaller, but the complexity of their manufacturing processes is showing an inverse upward trend. Therefore, jet technology has gradually shown its irreplaceable advantages due to its high speed, high complexity, and high precision.

Typical applications of jet valve technology:

SMA applications require a layer of coating adhesive (three proof adhesive) to be applied to the soldered PCB board. The advantage of spraying technology is that the nozzle of the glue valve can quickly spray multiple glue points in the same area, which can better coat the colloid without affecting the previous soldering effect.

Corner bonding process refers to the pre application of surface mount adhesive (SMA) on the edges and corners of the BGA bonding point matrix before bonding the BGA chip to the PCB board. For corner bonding, the advantage of spray dispensing is high speed and precision, as it can work the dispensing points to the edge of integrated circuits.

Chip stacking process involves stacking multiple chips layer by layer to form a single semiconductor packaging component. The advantage of spray technology is that it can spray glue onto the edges of assembled components, allowing glue to flow through capillary penetration into the gaps between stacked chips without damaging the solder wires on the side of the chips.

Chip flip, which provides stronger mechanical connections to semiconductor devices such as integrated circuit chips and microelectromechanical systems (MEMS) connected to external circuits through bottom filling technology. Stable high-speed spray dispensing technology can provide greater advantages for these applications.

IC packaging refers to the use of UV glue to package components on a flexible or hard board surface. Packaging endows the surface of a circuit board with the strength and stability required under constantly changing environmental conditions. Spray dispensing is an ideal process for IC packaging.

Lubrication of medical syringes, adhesive bonding of optical silicone endoscope lenses, UV adhesive needle bonding, precise distribution of protein solutions, and other applications that have strict requirements for speed and adhesive spot size, spray technology is a good solution.

Spray biological materials and reagents onto blood glucose test strips and animal detection test strips. During the process of spraying the materials onto the test strips, spraying technology can achieve high speed, precision, and stability. Spray technology can also avoid cross contamination during operation, as there is no contact between the valve body and the substrate surface throughout the entire process.

Application in LED industry: Spray glue on LED chips before assembly of fluorescent layer, apply silicone spray on LED packaging, and apply adhesive on COB multi junction packaging dam.