X-ray defect detection equipment can detect which defects in BGA packaging

In the past decade, the performance of tin based printing machines and surface mount technology (SMT) mounting machines has improved, resulting in improved assembly speed, accuracy, and reliability. The production of components is almost fully automated, which eliminates errors that may occur due to manual assembly. However, in the surface mount printed circuit board manufacturing industry, the miniaturization and intensification of components have always been a development trend, resulting in quality defects such as solder paste fouling and component offset that cannot be reliably and consistently detected by manual means. So X-ray defect detection equipment is highly favored.

Automatic X-ray inspection is a new testing technology that has only emerged in recent years. After the assembled circuit board enters the machine along the guide rail, there is an X-Ray emission tube located above the circuit board. The X-rays emitted by the tube pass through the circuit board and are received by the detector (usually a camera) placed below. Due to the presence of lead in the solder joint that can absorb a large amount of rays, compared to rays passing through other materials such as glass fiber, copper, silicon, etc., the rays irradiated on the solder joint are greatly absorbed, resulting in black spots that produce a good image, This makes the analysis of solder joints quite intuitive, so simple image analysis algorithms can automatically and reliably detect solder joint defects.

And what defects can X-ray defect detection equipment detect in BGA packaging?

1. Detection of BGA packaging devices themselves. In the production process of BGA packaging devices, it may cause solder ball loss, solder ball too small or too large, solder ball bridging, and solder ball defects. The inspection of BGA packaging devices mainly focuses on checking whether the solder balls are lost or deformed.

2. Inspection of BGA packaging device assembly solder joints. Mainly inspect the solder joints for bridging, open circuits, insufficient solder, missing balls, pores, displacement, etc.

3. The BGA solder ball itself may have holes or pores before welding, which is caused by the production process of BGA solder balls. PCB reflow welding is an important reason for the formation of voids if the temperature curve design is not reasonable. X-ray defect detection technology can also conveniently and directly detect the defect.