How to better detect chips after packaging

When it comes to IC chips, many people will not be unfamiliar with them. For example, the phones, televisions, and computers we use all contain chips, which are actually integrated circuits. IC chips are a piece of chip made by processing a large number of microelectronic components such as capacitors and resistors on a substrate.

How are IC chips made?

IC chips are composed of countless micro electronic devices and components, so their precision is unquestionable. Through corresponding manufacturing processes, the transistors, resistors, capacitors, diodes, and other components and wiring required in a circuit are interconnected, and they are made on a small or even a few small semiconductor chips or dielectric substrates. Next, they are packaged in a shell, becoming a microstructure with the required circuit functions.

Traditional chip detection methods

All components are structurally packaged as a whole, taking a big step towards miniaturization, low power consumption, and high reliability of electronic components. The more precise the circuit, the higher the difficulty of its detection. At present, when testing chips in China, the usual method is to peel them off layer by layer, and then use an electron microscope to photograph the surface of each layer of the chip. This traditional detection method can bring certain destructiveness to the chip.

New chip detection methods

The internal detection method of chips is to use scientific technology to analyze them internally. The popular methods on the market are CT and X-RAY. These two detection methods are very suitable for enterprises that require high product requirements and high product failure rates. Through powerful internal penetration technology, they can effectively transmit the interior of the product, and then the detector converts the received signal into an image on the display.