Requirements for semiconductor reflow soldering equipment and processes

Reflow soldering is a very important process technology in semiconductor manufacturing. Reflow soldering is mainly used to form reliable electrical connections on semiconductor chips to ensure the reliability and stability of electronic products. JEENOCE will provide a detailed introduction to the definition, principle, equipment, and process of semiconductor reflow soldering.

(1) Meaning of semiconductor reflow soldering

Semiconductor reflow soldering is a process technology used to establish electrical connections on semiconductor chips. This process involves heating the solder to melt and flow, thereby connecting the pins on the chip to the solder pads on the circuit board. Reflow soldering can be applied to packaging, assembly, and connection of semiconductor chips and surface mount components.

(2) Working principle of reflow soldering

The working principle of reflow soldering mainly involves factors such as heat distribution, temperature control, and solder characteristics. In the reflow soldering process, the solder is first placed between the chip and the circuit board, and then the entire structure is heated in a heater. The temperature controller of the heater adjusts the temperature according to the preset temperature curve to ensure temperature uniformity and stability throughout the entire process.

Whenever solder receives sufficient heat, it melts and flows, filling the gap between chip pins and circuit board pads. After cooling, the solder will solidify and form a reliable electrical connection. To ensure the quality of the connection, the properties of the solder are also crucial, including appropriate fluidity, wettability, and melting point.

(3) Semiconductor reflow soldering

Semiconductor reflow soldering equipment is a core component of the reflow soldering process, with the ultimate goal of establishing reliable electrical connections between circuit boards and chips by heating and melting solder. Its main processes are as follows

1、 By reflow operation, the solder paste printed on the convex metal surface is melted into a ball shape, thereby achieving welding connection between the solder ball and the substrate;

2、 By attaching the chip to the integrated circuit board, it is possible to connect the chip to the circuit board, ultimately achieving chip packaging and integrated circuit manufacturing production.

The semiconductor reflow soldering equipment should pay attention to the following points during the reflow soldering process:

1. To ensure that welding quality is not affected by dust and pollutants, it is necessary to maintain a clean production environment.

2. In order to improve production efficiency, it is necessary to control the production pace and output.

3. In order to prevent damage to components, it is necessary to minimize the thermal shock they are subjected to.

4. To meet the mechanical and electrical performance requirements, it is necessary to control the shape and size of the solder joints.

5. To avoid thermal damage and solder oxidation, it is necessary to control the temperature and heating time of the heating area.