Application of X-ray detection equipment for packaged devices

With the rapid development of electronic technology, the miniaturization of packaging, the high density of assembly, and the continuous emergence of various new equipment, the requirements for assembly quality are also increasing. Therefore, higher requirements have been put forward for inspection methods and techniques. In order to meet this requirement, new detection technologies are constantly emerging, among which Automatic X-Ray detection technology (Automaticx Rayinspection) is a typical representative. It can not only detect invisible solder joints, but also qualitatively and quantitatively analyze the detection results to detect faults as soon as possible.

In recent years, AXI automatic detection equipment has developed rapidly, from 2D detection in the past to 3D detection. It has SPC statistical control function and can be connected to assembly equipment to achieve real-time monitoring of assembly quality. The current 3D detection equipment is divided into two categories:

(1) No layered functionality.

This device uses a robotic hand to rotate the PCBA from multiple angles to form images from different angles, and then uses a computer to synthesize and analyze the images to determine defects.

(2) Has layered functionality.

Computer layered scanning technology (Industrial CT) can provide two-dimensional or three-dimensional representations that traditional X-ray imaging techniques cannot achieve. In addition, the phenomenon of image overlap and confusion with real defects is avoided. It can clearly display the internal structure of the tested object, improve the ability to identify internal defects of the object, and more accurately identify the position of internal defects of the object. These devices have two imaging methods: an X-ray tube emits an X-ray beam and accurately focuses it on a certain layer of the measured object. The measured object is placed on a rotatable platform, which rotates at high speed to clearly present the image of the focal surface on the receiver. Then, the CCD camera converts the image signal into a digital signal and hands it over to the computer for processing and analysis. This method focuses the x beam precisely on a certain layer of the PCB, and then the image is received by the high-speed rotating receiving surface. Due to the high-speed rotation of the receiving surface, the image on the focal point is clear, rather than being eliminated. Through the synthesis and analysis of images at different levels by computer, it is possible to inspect the structure of multi-layer boards and solder joints.

X-Ray detection can fully reflect the welding quality of solder joints, including open circuits, short circuits, holes, holes, internal bubbles, and insufficient tin content, and can be quantitatively analyzed. The biggest feature of X-Ray detection is that it can detect solder joint defects under BGA packaging equipment, such as bridging, open circuit, solder ball loss, displacement, insufficient solder, holes, solder balls, and blurry solder joint edges.