M2 AOI
The M2 offers high-speed microelectronic device inspection with exceptional defect coverage. With resolutions down to submircon levels and telecentric optics, the M2 provides complete inspection, all within a footprint less than 1 sq. meter.
Automated Optical Inspection for Microelectronics
Megapixel color imaging
High magnification
top-down viewing cameraQuick set-up
High speed
High defect coverage
Low false failure rate
Nordson YESTECH’s advanced megapixel technology offers high-speed device inspection with exceptional defect coverage. With high resolution and telecentric optics, M2 inspects bond wires, die placement,SMT components and substrates,all within a footprint less than 1 sq. meter.The M2 can be put in-line with your wire bonders or off-line to support several bonders. A magazine loader/unloader is available for off-line operations.
Programming the M2 is fast and intuitive. With CAD data input, a complete recipe can be completed in less than 1 hour*. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production.
The M2 utilizes several image processing algorithms to perform a multitude of inspections historically performed manually by operators using eyepiece microscopes.Real-time color, normalized gray scale correlation,pattern matching and binary “blob”analysis are just a few of the tools used to automate the process.
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