Vacuum contact welding is the perfect choice for power electronics production

　　Nexus based on the contact heating function in vacuum environment can ensure higher welding quality and improve production efficiency to meet the production requirements of advanced packaging and power electronics. Vacuum process can improve wettability and avoid solder joint oxidation, so as to better fill the gap in solder joint and reduce welding cavity. The standard welding temperature of the system can be as high as 400 ℃.

　　Application fields of contact welding process

　　Contact welding process is widely used in many fields. With the increasing demand for alternative energy, the demand for power electronics, semiconductors and wafer technology is also growing.

　　These are increasingly used in track drive systems, wind power generation systems, battery storage and automotive industry. In order to meet the increasing demand for reliability and safety of modern power modular, hybrid and multi chip modules, contact welding has become the first choice for small and medium-sized mass production and laboratory applications with compact structural design and high user friendliness.

　　Why contact welding?

• Cavity free and oxidation free welding of chip and circuit substrate

• Integrated or separate cleaning and descaling

• Rapid heating and cooling

• Assembly of shell parts under controllable vacuum conditions

• Integrated drying and exhaust process

• Improving redundant heat dispersion in void free welding