Factors affecting the speed of plate splitting machine equipment

1. It is the thickness of the board. The thicker the thickness, the slower the cutting speed is.

2. It is the hardness of the board. Generally speaking, the cutting speed of boards with higher hardness is slower than that of boards with lower hardness.

3. Where the board is to be divided, the more places the board is to be divided, the slower the cutting.

4. A small part of the configuration of the dividing machine is the factor that affects the cutting speed. The curved dividing machine and the milling cutter off-line dividing machine mainly rely on the high-speed rotation of the milling cutter, and the high or low speed of the high-speed motorized spindle is also part of the reason. The speed of the mark point of the recognition board of the visual camera is fast or slow, which will also have a little influence. For more detailed factors, you can consult jeenoce, and I believe you will get a more professional reply.

What are the influencing factors of PCB splitter stress

From the perspective of physics, we can know that when a material cannot produce displacement under the action of external forces, its geometry and size will change. This deformation is called strain. When the material deforms, the internal reaction force with equal size but opposite direction is generated to resist the external force, and the concentration of the internal force distributed at one point is called stress. Simply put, the internal force per unit area at a certain point of the section under consideration is called stress. Those perpendicular to the section are called normal stress or normal stress, and those tangent to the section are called shear stress or shear stress.

We are an independent manufacturer of PCB splitting machine, and we have great advantages and strength in all aspects of splitting machine. About the stress of the dividing machine, it is also a problem that the dividing machine design engineers often think about. We usually say that the press divider, milling cutter divider and laser divider have little stress, so what are the specific factors that affect the stress of PCB divider?

First of all, like some knife fed PCB splitting machines, the PCB substrate does not move during the cutting process, and the circular knife slides, which can ensure that the electronic components of the substrate will not be damaged due to movement, and it is also a factor affecting the stress of the splitting machine. In addition, the sliding speed of the round knife can be adjusted, the depth of the V-groove, the tool loss, and the precise adjustment of the spacing between the upper round knife and the lower straight knife all affect the stress of the dividing machine.

Secondly, we use the PCB splitting machine to minimize the stress, so that we can avoid the damage of PCB tin crack caused by the splitting process. In some splitting machines, the splitting is completed by parts crossing the V-slot, the cutting speed is controlled by the knob, and the splitting stroke can be set freely with LCD display. These are also the influencing factors of PCB splitting machine stress.