Factors influencing the speed of plate splitting machine

1. it is the thickness of the plate. The thicker the thickness, the slower the cutting speed is.

2. it is the hardness of the board. Generally speaking, the cutting speed of boards with higher hardness is slower than that of boards with lower hardness.

3. where the board is to be divided, the more places the board is to be divided, the slower the cutting.

4. a small part of the configuration of the plate splitting machine is the factor that affects the cutting speed. The curved plate splitting machine and the milling cutter off-line plate splitting machine mainly rely on the high-speed rotation of the milling cutter. The high or low speed of the high-speed motorized spindle is also a part of the reason. The speed of the mark point on the recognition board of the visual camera is fast or slow, which will also have some impact. For more detailed factors, you can consult jeenoce, and I believe you will get a more professional reply.

What are the influencing factors of PCB splitting machine stress

From the point of physics, we can know that when the material can not produce displacement under the action of external force, its geometry and size will change. This deformation is called strain. When the material is deformed, the internal reaction force with the same size but opposite direction is generated to resist the external force. The concentration of the distributed internal force at one point is called stress. Simply put, the internal force per unit area at a certain point of the section under consideration is called stress. Those perpendicular to the section are called normal stress or normal stress, and those tangent to the section are called shear stress or shear stress.

We are an independent manufacturer of PCB splitting machines, and we have great advantages and strength in all aspects of splitting machines. About the stress of the dividing machine, it is also a problem that the dividing machine design engineers often think about. We usually say that the press divider, milling cutter divider and laser divider have little stress, so what are the specific factors that affect the stress of PCB divider?

First of all, for example, during the cutting process of some walking type PCB splitting machines, the PCB base plate does not move, and the circular knife slides, which can ensure that the electronic components of the base plate will not be damaged due to movement, and it is also a factor affecting the stress of the splitting machine. In addition, the sliding speed of the circular cutter can be adjusted, the depth of the V groove, the tool loss, and the precise adjustment of the interval between the upper circular cutter and the lower straight cutter all have an impact on the stress of the dividing machine.

Secondly, we use the PCB splitting machine to minimize the stress, so as to avoid the damage of PCB tin crack caused by the splitting process. In some splitting machines, the splitting is completed by the parts crossing the V-slot. The cutting speed is controlled by the knob. The splitting stroke can be freely set and displayed on the LCD. These are also the factors affecting the stress of the PCB splitting machine.