Characteristics and advantages of reflow soldering of flip chip
Release time：2022-05-25Publisher:Jeenoce
Flip chip reflow soldering is a kind of chip that can be directly connected with ceramic substrate without welding wire. We call it Da chip. The current flip chip reflow soldering is different from the flip chip that needs to be transferred to the silicon or other material substrate with welding wire in the early stage. The traditional flip chip is connected to the substrate with welding wire face up, while the flip chip is face down, which is equivalent to subverting the traditional chip.
Characteristics of reflow soldering of flip chip
In fact, flip chip has a long history, parallel to vertical and horizontal structures. Its luminescence characteristic is that the active layer is downward, and the transparent sapphire layer is above the active layer. The light from the active layer needs to pass through the sapphire substrate to reach the outside of the chip.
Advantages of flip chip reflow soldering
1. Good heat dissipation performance. Since the active layer of the flip chip is close to the substrate, the heat flow path from the heat source to the substrate is shortened, and the thermal resistance of the flip chip is low, so the performance of the flip chip from light to thermal stability is almost not reduced.
2. In terms of luminous performance, the luminous efficiency is high under high current driving. Flip chip has good current expansion performance and ohmic contact performance. The voltage drop of flip chip is generally lower than that of traditional chip and vertical chip, which makes flip chip have great advantages in high current driving and show higher optical efficiency.
3. Under the condition of high power, flip chip is safer and more reliable than formal chip. In devices, especially in high-power lens packaging (except for the traditional anti lumen structure with protective shell), more than half of the dead light is related to the damage of gold wire.
4. Smaller size, lower product maintenance cost and easier matching of optical components. At the same time, it also laid a foundation for the development of subsequent packaging technology.
