Why should dust be removed in the plate splitting process of the plate splitting machine?

Based on the on-site management experience of dust removal process of milling cutter plate splitting machine, in view of the current project on-site management status of high-speed processing, intensive components, low-cost circuit board raw materials and strict quality requirements in the factory, this paper focuses on the on-site project equipment design, fixture design, milling cutter design, circuit board assembly design and circuit board substrate elements, I would like to share the process management, especially the on-site management of automotive electronics with strict quality requirements.

With the increasing competition in the electronic industry, low cost has become a trend. Therefore, in the design of circuit board, strive for product miniaturization, component integration / densification, and strive for low cost in the selection of circuit board substrate. At the same time, in order to meet the high requirements of customers for product quality, especially for high-performance electronic products such as automotive electronics, the circuit board design requires high reliability, so the pre cutting of products will be less and less, that is, the connection between panels will be more and more. In terms of circuit board substrate, in order to ensure the performance stability of circuit board in high temperature environment in lead-free reflow soldering process and reduce production cost, circuit board manufacturers will add SiO2 and other high-temperature resistant materials to the substrate. The addition of these materials has posed an unprecedented challenge to the dust removal of panel splitting process.

In addition to 5S and appearance problems, the dust of the product will also enter the mechanical parts of equipment such as bearings and cylinders, resulting in accelerated loss of accessories. In addition, the residue of product dust will also cause problems such as poor contact in subsequent processes such as testing. Some products need to be burned after SMT process, and there will be copper wiring on the cutting path, so a very small amount of dust may cause the risk of product short circuit. In recent years, with customers' attention to product quality, the requirements for dust residue are becoming more and more strict.

We should attach great importance to these process problems. For process improvement, we need to fundamentally and make targeted improvements, so as to better improve the current situation of the industry and promote its progress and development.

Ensure the effective management of dust removal process and create good economic benefits. Process management activities are to provide qualified products to the market and society and make profits from them. Only by providing products with good quality, reasonable delivery date and unit price can they be recognized by the market.

Implement and control process standards, establish a quality assurance system, highlight on-site quality control, and require enterprises to focus on the process site. In addition, reduce or eliminate the ineffective labor on the process site, improve the combination state of people, equipment and raw materials on the site, and reduce the consumption of manpower and equipment caused by cleaning product dust after splitting, so as to save expenses for the enterprise. The delay or rush of production and shipment will directly affect the quality, safety and cost of products.