Difference between vacuum reflux furnace and ordinary reflux furnace

The times are developing and technology is constantly updating, and the most prominent performance is electronic products. In order to meet the trend of the market, many related manufacturing equipment are also being reformed. The vacuum reflux furnace came into being in this case. Vacuum reflow furnace is also called vacuum welding furnace (vacuum eutectic furnace). Carry out high-quality welding of products in vacuum environment, and introduce reducing systems (N2, formic acid, N2H2, H2) during heating or cooling to protect products and solder from oxidation. At the same time, react the oxides on the surface of products and solder, so as to improve the quality of welding surface and reduce the void rate of welding. In contrast, vacuum reflux furnace and ordinary reflux furnace can give play to more advantages. The following is a brief analysis of the specific advantages of vacuum reflux furnace in production and application by Suzhou jeenoce.

Greatly reduce the cavity in the solder and the organic combination with solder, and the cavity area can reach less than 1%. Improve the electrical characteristics and bonding performance of products.

The upper and lower hot air circulation heating mode, the double-sided plate solder can also be vacuum reflow welded at one time, which can greatly reduce the cavity, and the circuit board with aluminum heat sink can be welded.

The vacuum reflow furnace adopts the principle of infrared radiation heating, which has the characteristics of uniform temperature, ultra-low temperature safe welding, no temperature difference, no overheating, reliable and stable process parameters, no complex process test, low environmental protection cost and low operation. It can meet the needs of multi variety, small batch and high reliable welding of products and weld under vacuum conditions.

The vacuum reflow furnace can gradually move large bubbles to the outer edge of the pad by using the changed vacuum degree to prevent solder joint splashing. During welding and vacuum treatment, the assembly is fixed in the closed treatment chamber. The traditional system using vertical slot requires that the circuit board be vertically transferred to it in the liquid phase to form a sealed cavity, and then vacuum treatment. This welding system just has a good advantage for product quality. Under this condition, vacuum reflow welding can effectively reduce the void rate of the product welding surface by efficiently discharging the bubbles generated when the flux volatilizes in the solder, so as to effectively improve the welding quality of the product.

In terms of welding defect rate, the use of this welding technology can greatly reduce the welding defect rate, reduce material loss and damage to the welding object. We all know that for precision electronic instruments, as long as there is an error in a welding release, it may lead to program confusion and even the equipment can not work normally. Therefore, the vacuum welding technology of reflow welding is very necessary and can not be replaced.