How does an X-ray detector detect IC chips

The full English name for IC chip is Integrated Circuit Chip. By placing a large number of microelectronic components (transistors, resistors, capacitors, etc.) into an integrated circuit on a plastic substrate, a chip can be made. IC chips include wafer chips and packaging chips, and the corresponding IC chip production line consists of two parts: wafer production line and packaging production line.

In the past, the chip was tested using a layer by layer peeling method, using an electron microscope to capture the surface of each layer of the chip. It is undeniable that this traditional detection will inevitably have a certain impact on the chip, and it was not until the emergence of X-ray detection machines that IC chips entered the non-destructive testing stage.

By generating X-rays through an X-ray tube and utilizing the absorption and scattering attenuation properties of the rays passing through the object, a perspective image of the scanned object is formed on the image intensifier. Foreign objects inside the IC, such as metal wires, excess wires, and excess Dies, as well as linear defects in the IC, such as collapsed wires, wire swings, tight wires, low wire arcs, high wire arcs, flat tops, flying wires, missing wires, and broken wires, can all be detected online.