What is the reflow soldering temperature curve
Release time：2024-06-03Publisher:Jeenoce
The reflow soldering temperature curve refers to the curve of the temperature on a certain pin of the SMT component over time when it passes through the reflow soldering furnace. The temperature curve is a function of the temperature applied to the assembled components over time, Y=F (T), reflected as a curve of the temperature at a given point on the printed circuit board changing over time during the reflow process. The temperature curve can be further divided into RSS curve and RTS curve. Below, JEENOCE will specifically explain what is the reflow soldering temperature curve.
RSS type reflow soldering temperature curve: It is a temperature curve composed of four temperature ranges: heating, insulation, reflow, and cooling. Each temperature range plays a different role in the entire reflow soldering process. Heating zone: By slowly heating the printed circuit board from room temperature to 135-170 ℃ (SN63/PB37), the heating rate is generally 1-3 ℃/s. Insulation zone: By maintaining a relatively stable temperature, the flux inside the solder paste is activated and appropriately dissipated. Reflow zone: The temperature inside the furnace reaches its highest point, causing the solder paste to liquefy. An alloy is formed between the solder pads of the printed circuit board and the solder electrodes of the components, completing the welding process. Cooling zone: Cool down the printed circuit board after welding.
RTS type reflow soldering temperature curve: It is a temperature curve from heating up to reflow. It can be divided into heating zone and cooling zone. Heating zone: accounts for 2/3 of the entire reflow soldering process, with a gentle speed generally ranging from 0.5 to 1.5 ℃/S. Raise the temperature of the printed circuit board from room temperature to peak temperature. Cooling zone: Cool down the printed circuit board after welding.
Comparison between RSS type reflow soldering temperature curve and RTS type reflow soldering temperature curve:
RSS type reflow soldering temperature curve: Emphasis is placed on the combination of temperature and time, the interval division of the curve is fine, the production efficiency is high, and the adaptability is average. Suitable for products with smaller printed circuit board dimensions, smaller volume of components on the board, and fewer types.
RTS type reflow soldering temperature curve: Pay attention to the heating rate, the interval division of the curve is fuzzy, the production efficiency is not high, and the adaptability is strong. Suitable for products with large printed circuit board dimensions, large volume of components on the board, and a wide variety of types.
