What are the benefits of using a dispensing machine in industrial production?

1. The dispensing machine is easy and easy to operate

Few switch buttons, control screen display operation, full Chinese interface, various parameter recording and alarm, complete learning operation at once;

2. The dispensing machine can stabilize the dispensing amount

The key components are all high-performance products of the brand, which are not affected by environmental factors such as air pressure and temperature, and can avoid unstable glue, wire drawing, and broken glue;

3. The dispensing machine has a low dispensing action error value

The performance of key components and good design of mobile devices, with a total error value controlled within 0.01mm;

4. Quick editing and adjustment of the dispensing machine program

Use like a mobile phone, quickly adjust and edit through screen prompts, and set up for use immediately;

5. The dispensing machine is widely used, with fast speed and stability

Suitable for dispensing glue on various points, lines, surfaces, edges, and inner circles, with fast speed and small errors;

6. The dispensing machine can achieve multi platform work dispensing

Dual Y-axis design, dual platform operation, greatly improving work efficiency.

Defects and solutions during the dispensing process of the dispensing machine

(1) Adhesive cables and tails

Pulling and dragging are common phenomena during the dispensing process. Even glue specially prepared for high-speed dispensing may experience wire drawing, which makes it easier for the glue to fall off and may also cause virtual soldering, which may be the cause of the issue. Improper adjustment of the process parameters of the glue machine equipment, such as small inner diameter of the needle, high dispensing pressure, and large spacing between the needle and PCB; Another reason may be insufficient understanding of the performance of patch adhesives. Incompatible with the application process, or the quality of the SMT adhesive is poor, with changes in viscosity or expired. Other reasons can also cause pulling/dragging, such as electrostatic discharge on the board, board bending, or insufficient board support.

(2) Empty or low glue output

There is a slight glue action when dispensing, but there is no glue or the needle glue is too small. There may be three reasons: bubbles mixed in the SMT adhesive, blocked needles, or insufficient air pressure in the production line. At this point, the glue inside the syringe needs to be degassed, especially for self installed glue, and clean needles should be replaced regularly. Adjust the machine pressure appropriately. If blockage occurs frequently, it is possible to consider replacing the patch adhesive with another brand.

(3) Clearly discontinuous adhesive points

The size of discontinuous adhesive points affects the overall consistency of the bonding strength between components and PCBs. There are several reasons for this phenomenon: firstly, the needle tip falls on the cushion, and changing the needle can solve this problem; Secondly, the recovery time is not sufficient, increasing latency can solve the recovery problem; Thirdly, as the level of the adhesive surface decreases, the pressurization time is insufficient to complete the dispensing cycle. The problem of discontinuous adhesive size can be corrected by increasing the ratio of pressure to cycle time.