What abnormalities can X-RAY detection equipment detect?

The X-RAY non-destructive testing equipment uses high-energy electrons emitted by cathode ray tubes to rapidly impact metal targets under high pressure. During the impact process, the electrons suddenly decelerate, and the lost kinetic energy is released in the form of X-rays. The emitted X-ray source wavelength is extremely short and can penetrate many different materials. For positions that cannot be detected visually, X-ray penetration technology can be used to analyze the internal structure of the test object, and then observe the internal area of the test object without damaging the product.

The X-ray detection equipment can detect the following items:

1. Detect IC packaging defects, such as layer peeling, bursting, voids, or the integrity of wiring;

2. Circuit board defects, such as poor alignment, bridging, solder leakage, open circuit, etc;

3. Detection and measurement of voids in SMT solder joints;

4. Various connection lines may have defects such as open circuits, short circuits, and abnormal connections;

5. Cracks and defects in the material;

5. Size and defect detection of the product to be tested;