How to reduce bubble generation during BGA welding process?

Especially during BGA welding, when bubbles are generated, they can affect the quality of welding, thereby affecting the performance and reliability of the product. Therefore, JEENOCE will explore how to reduce bubble generation during BGA welding process.

What is BGA welding?

BGA soldering refers to the process of soldering BGA packaged chips onto a PCB board. BGA packaging is a high-density packaging characterized by a smaller packaging volume and larger chip area. Therefore, during the BGA soldering process, the chip will be more closely connected to the PCB board, resulting in higher soldering quality.

What are the reasons for the generation of bubbles during BGA welding process?

The generation of bubbles is mainly due to the heat and pressure during the welding process. At high temperatures, the molten tin metal is subjected to pressure, which will produce small bubbles, thereby affecting the quality of welding.

How to control the generation of bubbles during BGA welding process?

The generation of bubbles can be reduced by reducing the heat and pressure during the welding process. For example, high-quality solder can be used to ensure that the heat and pressure during the welding process are controlled within a certain range; Welding temperature can also be adjusted to reduce heat and pressure during the welding process.

What should be noted during BGA welding process?

In the BGA welding process, attention should be paid to selecting the appropriate welding temperature to ensure that the welding temperature is within a controllable range; In addition, high-quality solder should be selected to reduce heat and pressure during the welding process and avoid the generation of bubbles.

What tools should be used during BGA welding process?

In the BGA welding process, high-quality solder such as tin ingots should be used to ensure that the heat and pressure during the welding process are controlled within a certain range; In addition, high-quality welding machines should be used to ensure the quality of BGA welding.

How should bubbles be checked during BGA welding process?

During the BGA welding process, X-ray detectors can be used to check for bubbles, which can detect the bubbles during the welding process to ensure the quality of BGA welding.

This article aims to explore how to reduce the generation of bubbles during BGA welding process, thereby improving welding quality. Specifically, this includes reducing heat and pressure, using high-quality solder and welding machines, using X-ray detectors, and so on. The suggestions proposed in this article can be used to improve the quality of BGA welding, thereby enhancing the reliability and performance of products.