XRAY equipment detects BGA welding

BGA welding is an indispensable part of the welding process for electronic components and is also the most commonly used processing process for high-end precision components. During the processing, it is believed that some enterprises can see welding voids, commonly known as bubbles. This is mainly due to the organic matter of the soldering flux cracking in high-temperature environments, but due to the small gas size, it cannot break through the package of the solder paste, resulting in the formation of later bubbles.

If the bubble hole is very small, it can be ignored. If it exceeds a certain range, it needs to be taken seriously. According to industry technical requirements, it generally does not exceed 25%, otherwise it can easily lead to poor contact of components and affect the product's service life.

Below is a brief introduction to the common methods of BGA welding inspection:

High magnification visual inspection: Directly observe the surface of BGA welding through a high magnification mirror to see if there is any tin overflow. As BGA welding is a non pin welding, it is impossible to detect internal pin welding, so only external abnormalities of BGA can be observed;

XRAY detection: This is currently a mainstream operation method in the market, which achieves non-destructive testing of BGA internal abnormalities and can also achieve internal flaw detection for chips without pins. XRAY is also divided into planar XRAY, which is commonly seen in the market. XRAY is planar, also known as 2D, and 3D, also known as CT, which reconstructs numerous 2D images formed by slicing objects through a computer to create a three-dimensional effect. 2D is often used for simple detection, that is, it should not be too complex in the vertical direction, otherwise it is difficult to distinguish the location of anomalies. CT can reconstruct a three-dimensional effect, which can have a good effect on complex objects, The only downside is the high price, which is mainly imported, with prices often exceeding 2 million yuan.

For the detection of ordinary electronic components, 2D can be used to complete, especially in defects such as BGA bubble holes, IC chip bonding lines, ceramic cracks, and so on, with a lot of practical experience.